Cov khoom siv FR4 muaj cov khoom siv hluav taws xob zoo heev, cov khoom siv dag zog, thiab cov cua sov, thiab yog ib qho ntawm cov khoom siv feem ntau siv hauv kev lag luam PCB tam sim no.
1. Copper Lamination: Copper foil thiab pre-impregnated epoxy resin fiberglass daim ntaub raug nias ua ke nyob rau hauv qhov kub thiab txias los tsim ib lub substrate.
2. Qauv Hloov: Cov qauv Circuit Court raug xa mus rau txheej tooj liab siv photolithography.
3. Etching: Cov ntawv xov tooj tooj ntau dhau raug tshem tawm los ntawm kev siv tshuaj lom neeg los tsim cov kab hluav taws xob (kab dav / qhov sib txawv tuaj yeem ua me me li 3/3 mil).
4. Lamination thiab Drilling: Multilayer boards yuav tsum tau laminated thiab tsim los ntawm - qhov los ntawm cov tshuab drilling (qhov tsawg kawg nkaus txoj kab uas hla tuaj yeem ncav cuag 0.15mm) lossis laser drilling.
5. Kev Kho Hniav: Cov txheej txheem muaj xws li immersion kub (hnav-resistant, zoo solderability) los yog lead- dawb tin plating (ib puag ncig tus phooj ywg).