Copper Foil Substrate (Copper Film)
Copper Foil: Yeej muab faib ua electrolytic tooj liab thiab dov tooj liab. Cov tuab tuab yog 1oz, 1/2oz, thiab 1/3oz.
Substrate Zaj duab xis: Feem ntau thicknesses yog 1mil thiab 1/2mil.
Adhesive: Thickness yog txiav txim los ntawm cov neeg siv khoom xav tau.
Cover Zaj movie
Npog Zaj Duab Xis: Siv rau qhov chaw rwb thaiv tsev. Cov tuab tuab yog 1mil thiab 1/2mil.
Adhesive: Thickness yog txiav txim los ntawm cov neeg siv khoom xav tau.
Daim ntawv tso tawm: Tiv thaiv cov khoom txawv teb chaws los ntawm kev ua raws li cov nplaum ua ntej nias; txhawb kev ua haujlwm.
PI Stiffener Zaj duab xis
Txhim kho Plate: Txhim kho cov neeg kho tshuab lub zog ntawm FPC, ua kom yooj yim rau kev txhim kho nto. Cov tuab tuab yog 3mil rau 9mil.
Adhesive: Thickness yog txiav txim los ntawm cov neeg siv khoom xav tau.
Daim ntawv tso tawm: Tiv thaiv cov khoom txawv teb chaws los ntawm kev ua raws li cov nplaum ua ntej nias.
EMI: Electromagnetic shielding zaj duab xis, tiv thaiv Circuit Court nyob rau hauv lub Circuit Court board los ntawm sab nraud cuam tshuam (muaj zog electromagnetic teb los yog tej thaj chaw uas raug cuam tshuam).