Lub 40-txheej ultra- siab- nce arbitrary interconnection PCB yog siab-kawg luam tawm cov khoom siv hluav taws xob tsim los rau ultra-kev ua haujlwm siab thiab kev sib koom ua ke siab. Nws cov yam ntxwv tseem ceeb suav nrog tag nrho -txheej txheej tsis pub sib txuas, micron- qib precision raug, thiab siab- nrawm, qis- tsis sib kis. Nws tuaj yeem ua tau raws li qhov siab - kev sib txuas ceev ceev thiab ruaj khov hluav taws xob kev ua tau zoo ntawm cov khoom siv suav nrog, siab - kev sib txuas lus zaus, thiab high-end industrial tswj teb.
40-Layer Ultra-High-Rise Arbitrary Interconnection PCB Solution
Core Architecture thiab Layer Stack-up Logic Qhov kev daws teeb meem no siv 40 txheej ntawm cov ntawv ci tooj liab thiab siab- zaus, qis- poob insulating dielectric alternately nqus-laminated. Sab hauv, nws tau muab faib ua peb txheej txheej: teeb liab xaim txheej, txheej txheej hluav taws xob, thiab txheej tiv thaiv hauv av, txheej txheem raws li txoj cai sib luag thiab sib npaug kom ntseeg tau tag nrho cov qauv kev ruaj ntseg thiab kev ua tau zoo ntawm hluav taws xob. Cov txheej txheem kev sib txuas tsis ncaj ncees cuam tshuam cov txheej txheem kev txwv ntawm cov tsoos los ntawm- qhov thiab cov qhov muag tsis pom kev, tso cai rau kev tsim cov micro- dig muag los ntawm kev sib txuas ntawm ob txheej yam tsis muaj txheej txheej - los ntawm - txheej txheej hloov. Qhov no txhim kho kev sib txuas ceev thiab kev siv qhov chaw, ua rau txoj kev sib tshuam sib txuas yooj yim dua thiab ua haujlwm zoo dua.
Cov txheej txheem tseem ceeb ntawm Kev Ua Haujlwm
1. Precision qhov sib sau thiab interlayer kev sib txuas
Siv laser micro-drilling raws li cov tub ntxhais qhov- txoj kev tsim, ua ke nrog cov txheej txheem tag nrho ntawm cov tshuab electroplating filling, micro- dig muag vias nrog qhov tsawg kawg nkaus txoj kab uas hla ntawm 0.075mm yog tsim. Cov phab ntsa ntawm phab ntsa yog qhov sib xws thiab tsis muaj dab tsi -dawb, kom ntseeg tau tias muaj kev cuam tshuam ntawm interlayer. Cov txheej txheem kev sib xyaw ua ke yog siv thoob plaws hauv cov txheej txheem, tswj cov txheej txheem interlayer kom raug nyob rau hauv ± 25μm, kom tsis txhob muaj kev pheej hmoo ntawm kev tsis sib haum xeeb tom qab multilayer lamination thiab xyuas kom meej tag nrho cov txheej txheem ntawm 40-txheej txheej.
2. Fine Circuit Court tsim
Raws li laser direct imaging technology, micron -theem Circuit Court tsim nrog qhov tsawg kawg nkaus linewidth / qhov sib nrug ntawm 3mil tiav. Ua ke nrog siab -txheej txheem etching tswj, cov npoo ntawm lub voj voog yog du, thiab qhov ntev ntawm qhov ntev yog qhov ruaj khov, ua raws li cov kev xav tau ntawm cov teeb liab kis tau tus mob siab ntawm - qhov sib txawv ntawm qhov sib txuas.
3. Multilayer Nqus Lamination
Kev ua haujlwm kub segmented - tswj, sib npaug ntawm lub tshuab nqus tsev lamination txheej txheem, sib tw nrog qis - nthuav dav - cov khoom siv dielectric coefficient, lub warpage ntawm 40- txheej pawg thawj coj saib yog tswj tsis pub dhau 0.5%, zam kev tsis xws luag xws li interlayer-kev sib cais, kev ruaj ntseg ntev thiab kev ruaj ntseg.
Kev xaiv cov khoom siv thiab kev ua tau zoo txhawb siab siab- nrawm, siab- zaus ntawm cov substrates yog qhov tseem ceeb, xws li Rogers thiab Isola Astra MT77 qis- poob dielectrics, uas muaj qhov poob qis thiab cov dielectric tsis tu ncua, haum rau siab -ceev teeb liab kis tau tus mob ntawm 112Gbps thiab siab dua, txo qhov kev pheej hmoo ntawm distortion Kev ntsuas lub zog ntawm cov qauv thiab cov cua kub dissipation yuav tsum, siab thermal conductivity tooj liab ntawv ci thiab cov thermal expansion coefficient cov ntaub ntawv uas tsis tshua muaj thermal expansion coefficient rwb thaiv tsev yog siv los sib npaug cov neeg kho tshuab stability thiab thermal conductivity efficiency, kom ntseeg tau ntev - lub sij hawm ruaj khov nyob rau hauv high - fais fab scenarios.
4. Cov Ntsiab Lus Tseem Ceeb rau Kev Tswj Xyuas Hluav Taws Xob Kev Ua Haujlwm Zoo Tshaj Tawm:
Ua tiav ± 5% kam rau ua tswj rau ib zaug - xaus thiab txawv impedances. Tswj cov teeb liab txuas ntxiv impedance los ntawm cov khoom dielectric thickness thiab cov kab tsis ruaj khov, txo qhov kev xav thiab lub suab nrov.
Crosstalk Suppression Optimization: Siv cov teeb liab sab nraud thiab cov txheej txheej hauv av ntom ntom rau kev sib cais, ua kom lub teeb liab rov qab txoj kev, txo cov inter-txheej thiab inter- kab crosstalk, thiab txhim kho kev ruaj ntseg ntawm ntau-channel kev sib txuas.
Fais fab Kis Optimization: Tsim kom muaj tsawg-impedance fais fab mov network siv ntau- txheej txuas txuas txuas hluav taws xob thiab cov dav hlau hauv av, txo qis hluav taws xob poob thiab suab nrov cuam tshuam, thiab ua kom lub zog tag nrho ruaj khov.
Qhov kev daws teeb meem no feem ntau yog tsom rau cov xwm txheej xws li AI servers, supercomputing core boards, 5G / 6G kev sib txuas lus hauv paus chaw nres tsheb, siab -kawg RF cov cuab yeej, thiab cov khoom siv kuaj semiconductor. Piv nrog rau cov pa siab siab- txheej PCBs, nws txoj kev sib txuas tsis ncaj ncees muaj peev xwm txo tau ntawm hneev taw thiab nce kev sib koom ua ke kom ceev; 40-txheej txheem txheej txheem tuaj yeem ua kom haum cov teeb liab ywj pheej thiab cov khoom siv hluav taws xob, hais txog peb qhov kev xav tau ntawm kev kub ceev, kev ntseeg siab, thiab siab ceev, yog li dhau los ua qhov tseem ceeb ntawm kev txhawb nqa platform rau kev ua tau zoo ntawm high-end electronic hardware.