Nrog rau tam sim no tus qauv ntawm miniaturization thiab lightweighting ntawm cov khoom siv hluav taws xob, hloov tau yooj yim multilayer circuit boards (FPCs) tau txais kev siv dav hauv cov neeg siv khoom siv hluav taws xob, khoom siv hluav taws xob, thiab cov khoom siv kho mob vim lawv qhov tshwj xeeb yooj yooj yim thiab siab - muaj peev xwm xaim hluav taws xob. Txawm li cas los xij, ntsib nrog ntau yam khoom lag luam hauv kev ua lag luam, xaiv lub rooj sib txig sib txig sib txig sib luag uas ua tau raws li ob qho kev ua tau zoo thiab ua kom muaj kev ntseeg siab tau dhau los ua qhov tseem ceeb rau ntau pawg yuav khoom thiab R & D.
Ua ntej, txiav txim siab txog daim ntawv thov scenario ntawm FPC, xws li seb nws puas yuav tsum tau tiv thaiv kev khoov ntau zaus thiab kev ua haujlwm kub.
Kev Ua Haujlwm Hluav Taws Xob: Txhais qhov tsim nyog hluav taws xob tsis raws li qhov yuav tsum tau ua, xws li cov teeb liab kis tau tus nqi thiab lub peev xwm nqa tam sim no.
Mechanical Properties: Xav txog FPC qhov yooj yim, kub tsis kam, thiab kev laus ua haujlwm.
Substrate: Polyimide (PI) yog ib qho ntawm feem ntau siv substrates, muaj qhov kub thiab txias tsis kam thiab tshuaj stability. Rau tus nqi- cov khoom lag luam rhiab heev, polyester (PET) tuaj yeem txiav txim siab, tab sis nws yuav tsum tau sau tseg tias nws qhov ntsuas kub qis dua.
Copper foil type: Electrolytic copper yog haum rau zoo li qub lossis qis dua - zaus dabtsi yog khoov daim ntawv thov, thaum dov tooj liab yog tsim nyog rau siab - zaus dabtsi yog khoov los yog daim ntawv thov nrog nruj bending lub neej txoj cai.